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Posts: 68 | Thanked: 300 times | Joined on Mar 2017
#24
Originally Posted by pythoneye2 View Post
This is way more complicated than most other devices not only because of small pin size and count. But because of ram and flash sitting on top of cpu. You get all sort of complicated warping.
Ugh, sandwich SoCs are real crap. I remember times of Symbian phones, especially N73 which had that type of SoC. Absolute nightmare but I was soldering them by manually reball and fitting chips layer by layer. It's possible but needs a lot of time and focus. Nothing for mass production but one, maybe two units per day.
 

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